Engineering

Engineer, Metrology & Real Time Defects Analysis

🔬 Engineer, Metrology & Real Time Defects Analysis

MICRON SEMICONDUCTOR ASIA OPERATIONS PTE. LTD. is hiring an Engineer to join their Metrology and Defects Analysis team at their advanced manufacturing facility in North Coast Drive. This is a Full Time, Fresh/Entry Level role within the semiconductor industry.

Key Responsibilities

The role is focused on maximizing product yield and quality through advanced data analysis and process control:

  • Defect Analysis: Engage in designing experiments to identify defect sources and formation mechanisms. You will work to solve problems with yield or quality impact through the development of measurement recipes.

  • Statistical Process Control (SPC): Set up tool qualification criteria and implement monitoring through SPC charts. You will set control limits and utilize sampling for proactive intervention against machinery deviations.

  • Advanced Analytics: Apply innovative analytics and inspection tools to identify process deviations and contribute to breakthrough solutions for defectivity improvement.

  • Collaboration: Partner with tool suppliers and diverse engineering departments to optimize maintenance schedules and overcome challenges associated with shrinking technology nodes.

  • Project Management: Develop and run projects aimed at enhancing inline detection, improving machine availability, and reducing measurement variability.

Required Qualifications & Experience

  • Education: Bachelor’s or advanced degree in Engineering or Science is required.

  • Experience: While listed as entry-level with no experience required, an internship or experience in the semiconductor industry is an advantage.

  • Skills: Strong analytical, logical, and critical thinking skills. Must be an effective communicator capable of collaborating across all levels.

  • Flexibility: Capable of working on a flexible schedule, such as compressed shifts.

Salary & Benefits

The monthly salary for this position ranges from $4,800 to $5,500.

Closing Date

Applications close on January 21, 2026.

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